AORUS GeForce® GTX 1080 Xtreme Edition 8G GV-N1080AORUS X-8GDFeaturesPowered by GeForce® GTX 1080 CoreBoost: 1936 MHz / Base: 1784 MHz in OC mode |
AORUS graphics cards are crafted for perfection in pursuit of the ultimate graphics experience for gaming enthusiasts. Based on the revolutionary NVIDIA® Pascal™ GPU architecture, AORUS graphics card brings you incredible gaming experience. AORUS ALL-AROUND COOLING SOLUTION
AORUS provides the all-around cooling solution for all key components of the graphics card. We take care not only GPU but also VRAM and MOSFET, to ensure a stable overclock operation and longer life. On the front side, the large copper base plate dissipates the most heat from the GPU and VRAM. On the back side, the copper back plate dissipates the heat from the GPU back side. All other key components are taken care of very well by the WINDFORCE cooling module. AORUS ensures the customer a better cooling solution in many ways.
LARGE COPPER BASE PLATEWith direct contact to the GPU and VRAM, the large copper base plate combines the composite heat pipes to efficiently transfer heat generated from the interior cores to the heat sink.
ADVANCED COPPER BACK PLATE COOLINGExcessive heat from GPU not only gets dissipated utilizing the massive cooling module in the front but also through the back side with a big copper plate, providing a well-rounded thermal solution for the GPU.
WINDFORCE STACK 3X COOLING SYSTEMAll new WINDFORCE Stack cooling with 3X 100mm fans in an innovative stacking structure for enhanced heat dissipation. DOUBLE BALL BEARING STRUCTURE
The double ball bearing structure has better heat endurance and efficiency than sleeve structure ANGULAR FIN DESIGN
The angular and unequal fins height does not only channel the airflow through the fins and enlarge the contact surface but also results in a lower noise level and better cooling capacity. COMPOSITE HEAT-PIPES
The composite heat-pipes combines both thermal conductivity and phase transition for efficiently managing the transfer of heat between two solid interfaces which increases 29% of cooling capacity. |